2G HTS Wire Specification

Basic information about our REBCO 2G HTS wires is given below.

Basic Specification

REBCO formula

AP or HM

Substrate thickness

50 µm, or 30 µm 

Width

12, 6, 4, 3, or 2 mm 

Piece length

200 m to 500 m (up to more than 900 m), depending on spec

Stabilizer

Ag only – Type SF (Stabilizer Free), or

Ag plus electroplated Cu – Type SCS (Surround Cu Stabilizer)

Electroplated Cu stabilizer thickness

10 µm to 110 µm total (5 µm to 55 µm per side)

Critical current (essentially proportional to the width, determined using 1 µV/cm criterion via transport measurement)

Ic (77K, self-field)

120~160 A/4mm for AP tapes, 80~120 A/4mm for HM tapes      

In-field critical current at various temperatures

See graphs below for reference 

 

Mechanical properties

Axial tensile strength

(at 77K, self-field, for 95% original Ic retention)

Depending on substrate thickness and Cu stabilizer thickness

(e.g., 550 MPa for tapes on 50 µm thick substrate with total 40 µm Cu stabilizer)

Minimum bending diameter

(at 77K, self-field, for 95% original Ic retention)

11 mm for tapes on 50 µm thick substrate

6 mm for tapes on 30 µm thick substrate

 

Other options

Joint

Soldered lap joint, for Type SCS wires

(joint resistivity ~ 50 nΩ-cm2 at 77K, for HTS facing HTS)

Insulation

Wrapped 25 µm thick polyimide tape (butt wrapping or 30% overlapping)

Electroplated solder coating

SnPb solder 5 µm to 10 µm per side on Type SCS tapes

Fig 1

Fig. 1. Magnetic field dependence of critical current of a 4mm wide AP tape at various temperatures with the field in the direction perpendicular to the tape surface.

 

Fig 2

Fig. 2. Magnetic field dependence of critical current of a 4mm wide HM tape at various temperatures with the field in the direction perpendicular to the tape surface.